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HES International 2018

Attendees Applaud New HES International Conference

Advanced sensor technologies took center stage at HES International in Brussels, pointing towards a future of integrated opto and electro technologies in IoT, autonomous transport and wide-ranging cyber physical systems.

HES International recently concluded in Brussels, Belgium with a focus on advanced sensor technologies and applications of high-end sensors (HES) across many commercial and consumer market segments. Throughout the two-day program more than 600 attendees heard presentations from product and technology developers addressing opportunities in HES, photonic integrated circuits (PICs) and compound semiconductor (CS) technologies. Meeting rooms were packed as delegates and attendees circulated from one program to another, gaining insights into opportunities and challenges facing advanced IC innovators.

HES International and its focus on advanced sensing devices grew out of the successful Internet of Things (IoT) conference staged in 2017 alongside PIC and CS conferences. Throughout many IoT presentations, sensors quickly emerged as a common denominator in many IoT presentations, especially the most advanced devices still under development. This fact made it clear to conference organizers from Angel Business Communications that high-end sensors have rapidly become a linchpin technology that would continue to enable Smart City, Industry 4.0, flexible electronics, autonomous vehicle and many other other advanced applications that all share a common need to collect, analyze and communicate data with security and confidence.

Setting the tone on Day One of the conference was a keynote address by Olivier Sornique of Airbus, speaking about his role as Pressure Pad MEMS Projects Leader for flight test installations. Micro electromechanical system (MEMS) devices have emerged as one of the most versatile technologies for sensing a wide range of environmental and physical conditions as well as their well-established role as solid-state microphones.

Olivier told HES International delegates how Airbus utilized a range of commercially available MEMS devices in large volume to support a process the company describes as ‘measurement mapping’. Results to date have substantially surpassed previously available approaches, helping the company to ensure safety and reduce the time needed to conduct tests of new aircraft designs. Accuracy and repeatability of testing processes also increased substantially.

The successful integration of MEMS devices into a wide variety of high-end applications was a theme throughout the day. HES International attendees heard also from Bernhard Straub from Infineon Technologies who discussed ways that his company developed multiple generations of MEMS microphones for smartphone and related system applications. New core MEMS technology eliminated the issues Infineon had with legacy approaches for mobile sensing; the program now produces in excess of a billion devices annually with production expected to double or triple in the future.

Grenoble, France is home to CEA-Leti, one of the world’s largest research organization focused on advancing technology across many frontiers including high-end sensors. Leti’s efforts to develop and promote sensing technologies has led to a concentration of companies in the area, earning it the unofficial title of ‘Sensor Valley’ due to the fact that 10 of Europe’s largest advanced sensor developers are headquartered in and around Grenoble.

Sergio Nicoletti, coordinator of CEA-Leti’s MIRPHAB program, discussed optical sensor requirements and the important role that tunable lasers are expected to play in near-term product development as well as long range goals. He also detailed the role of MIRPHAB in helping new companies prototype devices while also conducting research into ways that sensors can decrease in size while consuming less power. Pierre-Damien Berger, also representing CEA-Leti, focused on the role of cyber physical systems (CPS) as enablers for high-end sensor development. Pierre-Damien spoke about the way that Leti has expertise in all aspects of developing microsystem and advanced sensors including MEMS, combining these for solutions tailored to the needs of various industry partners, helping manufacturers to identify and incorporate appropriate expertise into ongoing development programs. Their efforts include incubating new businesses, with six projects selected recently for continuing support and development activities.

Throughout the conference it was clear that the dozens of companies represented see crossover opportunities and alignment between the capabilities of optoelectronic devices including fiber optic sensors and PICs with the advantages of silicon and compound semiconductor technologies. Work to bring together photon and electron based tech was typically seen as foundational to the ongoing development of high-end sensing devices.

Demonstrating the potential of fiber sensing was Pim Kat of Technobis. His company has utilized fiber optic sensing technologies to dramatically reduce the size (and cost) of sensory systems. Technobis fiber sensors have found their way into applications across automotive sectors including high-end racing vehicles and designs that are helping advanced marine telemetry and measurement applications. He remarked that the ability to replace traditional bulk modules with multiple discrete optical or micro-optical components with a single small-sized chip are making PICs an increasingly popular basis for next generation fiber sensing systems. Pim demonstrated how successful their approach has been by showing their corporate offices that have more than doubled in size since the company opened its doors.

While many companies are developing and marketing highly advanced sensors for applications across major commercial sectors, the need to package new devices is also becoming increasingly acute. New technologies that are radically smaller than legacy modules are typically manufactured utilizing existing semiconductor processes and fab equipment, and due to the size, power and connectivity requirements also need new approaches to packaging. Peter O’Brien of the Tyndall National Institute spoke about the institute’s endeavors to lead the charge into creating new packaging for emerging sensor technologies and increase market opportunities. Tyndall works with university and industry partners to essentially create new packaging approaches designed to enable prototyping as well as processes for transferring their new packaging expertise into volume production environments.

Also examining packaging and the underlying materials requirements of new technologies was Maurus Tschirky of Evatec. He examined the way that new materials pairings and layer stacks create new behaviors which need to be appreciated and understood across every stage of production. Optical interference coatings and work with piezoelectric layers were highlights of his presentation along with examples of ways in which materials science is playing an ever more significant roles as new sensors are created.

While optical and MEMS-based sensor technologies were the focus of many presentations, Mohamed Missous, professor of semiconductor materials and devices at the University of Manchester and CTO of Advanced Hall Sensors (AHS) reminded his audience that magnetic high performance devices offer substantial advantages compared to other underlying technologies. Quantum Well Hall Effect (QWHE) devices are the focus of his work, and Mohamed offered a fascinating look into the detailed resolution of QWHE devices that utilize AC and DC magnetic field scanning, enabling the detection of minute cracks in metals and in new applications that may replace security scanners with new generations of magnetic scanning tools that are more accurate while also reducing energy consumption and the amount of energy emitted when scans take place.

The enthusiasm and professionalism of presenters at HES International 2018 demonstrated the vital role and expanding opportunity for high-end sensors to drive the development of commercial and consumer products. Look for future articles that delve deeper into 2018 presentations as work towards an expanded 2019 program gets underway.

See some of the highlights from the 2018 show in the CS-PIC-HES Conference video




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Image gallery HES International 2018




Monday 9th April 2018
18:00-21:00
Pre-conference networking drinks reception, organised by Angel Business Communications and in association with IQE PLC
Day 1 - Tuesday 10th April 2018
08:00
REGISTRATION - Includes Refreshments
08:50
Housekeeping by Mark Andrews, Conference Chair
09:15
Keynote MEMS Sensor Solutions in Flight Test Applications
Olivier Sornique, Airbus
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Advances in MEMS Sensor Development

Keynote

Presentation

MEMS Sensor Solutions in Flight Test Applications

Even while accuracy, repeatability and reliability are important aspects of commercial aircraft flight tests, Airbus has increased performance by developing its Measurement Mapping process that heightens sensor density. This achievement produces large data sets for in-depth analysis and has added a dimension to flight testing not possible with legacy solutions. Airbus also leverages off-the-shelf MEMS devices for Measurement Mapping, easing installation and reducing lead-times. The presentation will focus on the technology being utilized as part of the Airbus flight test environment and the company’s philosophy to continually improve upon its processes and global service and innovate the future of commercial air travel.

Speaker

Olivier Sornique

Airbus


Olivier Sornique is Pressure Pad MEMS Projects Leader for Flight Test Installation within the Airbus Commercial Aircraft business unit. His work in the Airbus Flight Tests Centre seeks new opportunities and product innovations focused on meeting and exceeding customer requirements; he is always looking to improve technical expertise in flight testing performance, safety and accuracy. Olivier focuses on MEMS technology dedicated to aerodynamic measurements that demand the highest levels of accuracy and performance. His work also involves the search for new and emerging MEMS technologies and manufacturing partners who share a zeal for uncompromising quality and service in highly competitive global markets.


09:35
The Open Architecture of Smart Sensor Suites
Wilmuth Muller, Fraunhofer IOSB
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Defence, Security, Aviation and Aerospace High-End Sensors

Presentation

The Open Architecture of Smart Sensor Suites

Military user requirements define the strong need for smart sensor suites comprising different multi-spectral imaging sensors as core elements as well as the use of additional non imaging sensors. The smart sensors suites as part of a reconnaissance and surveillance network will allow optimizing the use of various information sources for improving the situation awareness of military commanders.  In our study an open architecture of smart sensor suites has been designed, which has as starting point a set of system requirements. The open system architecture, based on a system-of-systems approach enables the combination of different sensors in multiple physical configurations, like distributed sensors, co-located sensors combined in a single package, sensors mounted on a tower, sensors integrated in a platform, and use of trigger sensors. The mode of operation is adaptable to a series of scenarios with respect to relevant objects of interest, activities to be observed, available transmission bandwidth, etc. The open system architecture has been designed in accordance with the NATO Architecture Framework NAF, v3.1. 


Speaker

Wilmuth Muller

Fraunhofer IOSB

09:55
MEMS sensors for high volume consumer applications
Bernhard Straub, Infineon Technologies
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Advances in MEMS Sensor Development

Presentation

MEMS sensors for high volume consumer applications

MEMS sensors are a key enabler for the trend towards smaller and cheaper sensors. Given this trend, more and more highly sophisticated sensors enter the consumer area and drive the “sensorfication” of our world. On this path, performance must not been scarified and stable production for highest volume applications such as smart phones must be ensured. But since the appearance of the Internet of Things (IoT) MEMs sensor suppliers are faced with another challenge. IoT devices are showing up everywhere and are radically changing how we do business and interact with the world around us. Devices equipped with intelligent semiconductors sensors are forming the foundation of the smart, secure and power efficient IoT that is developing around us. The "smartness" of these systems is achieved by stretching the boundaries of current design and technology. Intelligent devices are interconnected in ways that were not possible a few years ago and Artificial Intelligence (AI) algorithms are being used to process vast amounts of sensor data.  The combination of reliable high volume MEMs production, deep sensor system know-how and advanced algorithm capabilities will be key success factors for semiconductor sensor suppliers in the future.  


Speaker

Bernhard Straub

Infineon Technologies


Dr. Bernhard Straub works as Director and Head of Program Management for Consumer Sensors at Infineon Technologies in Munich. He is responsible to set-up and execute the roadmap for Infineon's MEMs sensors for consumer applications including mobile phone, smart home and home appliances. Beside that he drives the understanding of requirements for smart sensor systems at Infineon. Bernhard has a background of 17 years working in the semiconductor industry and was serving several functions from consulting, product marketing and M&A. He received a Diploma's degree in Physics at the Technical University of Munich and made his PhD at the Max Planck Institute of Biochemistry where he investigated the electrochemical coupling between genetically engineered human neuronal cells and field-effect transistors.

10:15
Miniaturization challenges in optical sensing
Sergio Nicoletti, CEA-Leti: MIRPHAB
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Imaging and Optical Sensing Advances

Presentation

Miniaturization challenges in optical sensing

The Mid-IR spectral range has been considered as the paradigm for innovative silicon photonic devices because of the growing potential in spectroscopy, materials processing, chemical and biomolecular sensing, security and industry applications. This talk will discuss the challenges of the miniaturization and the co-integration of photonics devices at chip and packaging level to address cost, size and power consumption. This approach is now pursued by the MIRPHAB Pilot Line which is offering access for fast prototyping and series fabrication of sensing devices.

Speaker

Sergio Nicoletti

CEA-Leti: MIRPHAB


Sergio Nicoletti obtained his PhD in 1996 working on HTc superconducting devices. From 1997 he was at CNR-IMM (Italy) working on Smart Sensors/Systems for air quality monitoring. In 2004 he took a visiting scientist position at HGST in San Jose (USA) working on magnetic recording heads devices. In 2006 he joined CEA-LETI MINATEC to work on “Sensors and Optical architectures for chemical detection” activity. Since then he has contributed to several proposals now part of the projects portfolio of this activity. He owns more than 20 patents and more than 65 publications. Sergio Nicoletti is now coordinating the H2020-MIRPHAB pilot line initiative.

10:35
Panel Session Advances in MEMS Sensor Development
Sergio Nicoletti, Bernhard Straub, Olivier Sornique, Martin Eibelhuber,
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Panel Session

Advances in MEMS Sensor Development

This panel session's abstract will be available shortly.

Speakers

Sergio Nicoletti

CEA-Leti: MIRPHAB

Bernhard Straub

Infineon Technologies

Olivier Sornique

Airbus

Martin Eibelhuber

EV Group

10:55
Morning Refreshment Break
11:30
Speeding innovation for industry with CPS (Cyber Physical Systems) - from microsensors to low power embedded HW/SW systems
Pierre-Damien Berger, CEA-Leti
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Optimizing IoT and IIoT Sensor Networks and Security

Presentation

Speeding innovation for industry with CPS (Cyber Physical Systems) - from microsensors to low power embedded HW/SW systems

CyberPhysical Systems enhance high End Sensor by providing a full and complete solution. CPSs are systems that link the physical world (e.g., through sensors or actuators) with the virtual world of information processing. They are composed from diverse constituent parts that collaborate to create some global behaviour. These constituents will include software systems, communications technology, and sensors/actuators that interact with the real world, often including embedded technologies. CEA LETI, leader in this domain masters all the different blocks, microsystem & high-end sensors like MEMS, and all the parts to enable the right solution for the application required by the industrial partners. CEA LETI is also leading European Projects providing opportunities for companies to develop their own solution.


Speaker

Pierre-Damien Berger

CEA-Leti


Dr Pierre Damien Berger was born in 1969 and received his doctoral level in 1997. In 1998, he promoted technological research from labs to industry in the sensor field and in 2000, was appointed as R&D Program Manager at ATMEL Grenoble. In 2007, Pierre led the Smart Device Programs at CEA Tech - LETI. In 2015, Pierre became Strategic Partnership Manager at CEA Tech and covered the whole IoT landscape. Currently Pierre is the European Projects coordinator for the CPS (Cyber Physical System) activity at CEA Tech - LETI. Since 2016, he has been elected National Secretary of the #IoT#Manufacturing thematic network with strong links to the start-up ecosystem.


11:50
Considerations in IoT Technologies
Joep van Eijden, Sigma Designs
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Optimizing IoT and IIoT Sensor Networks and Security

Presentation

Considerations in IoT Technologies

The Internet of Things technology has been advancing, and consequently growing across residential, commercial and industrial spaces. It is poised to make an impact as it reaches mass adoption, but for this to occur, the technologies behind it need to be optimized for connectivity, security, interoperability and considering future advancement and uses. The Z-Wave communications protocol dominates the residential IoT market with smart home products, and is paving the way for security responsibility. Z-Wave is now protected by the Security 2 (S2) framework, which was developed with the hacker community. S2 comes within the Z-Wave system-on-chip, so manufacturers don’t have to learn or deploy extra security measures to secure devices. These steps can serve as a model as other industries develop. In this talk, Johan Pedersen from Sigma Designs will examine the considerations needed in designing IoT technologies, including interoperability, security and future features.

Speaker

Joep van Eijden

Sigma Designs


Joep van Eijden is the Z-Wave Sales and Business Development at Sigma Designs. Before starting in 2015, he held project management positions for various cable and digital TV products and gateways at Hitron Technologies, Ubee Interactive, and NXP Semiconductors. At Sigma Designs, he works towards growing the Z-Wave device ecosystem by working with Z-Wave partner companies and identifying new opportunities related to the smart home industry.

Joep holds a BSc in electronics and a bachelor of engineering and industrial marketing from Fonts Hogescholen.



12:10
Lunch Break
13:30
Meeting Energy Demand for IoT Sensors with Solid State Batteries
Denis Pasero, Ilika Technologies
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Emerging Opportunities and Applications

Presentation

Meeting Energy Demand for IoT Sensors with Solid State Batteries

As the number of wireless IoT sensors is ever increasing and their dimensions are ever decreasing, the availability of energy dense power sources is critical. A solution for low-maintenance, autonomous power combines energy harvesters with small size, long life energy storage devices to provide 24/7 operation. This presentation will review alternatives for the use of energy harvesting (solar, thermal, vibration) and compare available energy storage solutions such as conventional batteries (primary or secondary), super-capacitors, Li-polymer batteries and solid state batteries such as Ilika’s Stereax, in use cases ranging across Industrial IoT, Smart Automotive, MedTech, Smart Homes and Cities.

Speaker

Denis Pasero

Ilika Technologies


Denis joined Ilika in 2008, as a scientist specializing in battery technology, to manage commercial lithium ion projects and became part of the Ilika team to apply his strong academic knowledge to commercial applications - seeing the potential to be part of the development and success story of an enterprising smaller company with exciting technology and novel product ideas. Today, as Product Commercialisation Manager, Denis interfaces between customers and technical teams.

13:50
Sensing is life: The survival of the fittest in high end sensing
Rainer Minixhofer, AMS AG
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Imaging and Optical Sensing Advances

Presentation

Sensing is life: The survival of the fittest in high end sensing

Sensors are a source of a constant stream of data about our environment, our habits and even our health. Together with the digitalization revolution, new challenges in the way this data is processed, stored and reported to the user are surfacing. An overview on the sensor solutions in vertical markets like wearables, smart home, medical electronics, industrial automation, connected cars and smart cities is given. The overall structure of the value chain splitting into integration services, software applications and infrastructure, connectivity and hardware will also be described. The current sensor architectures in terms of key system blocks like sensor, actuator, energy management, memory, processing and wireless connectivity is reviewed. Finally an extrapolation to future solutions and their system block architecture is given, leading to an overview on how theses systems will evolve in the next few years. New sensor functions and their application are identified and the key aspect of combination of multiple sensor raw data processing and combination is reviewed.

Speaker

Rainer Minixhofer

AMS AG


Rainer Minixhofer received his M.S. degree in technical physics from the University of Technology Graz, Austria, in 1995 and his PhD degree in microelectronics from the University of Technology Vienna, Austria in 2006. Currently, he is Senior Director Technology at ams AG responsible for corporate process technologies, device and IP development, electrical test and software. His scientific interests are 3-dimensional process & device simulation, specialized system-on-chip sensor solutions and photonics. His management interests are project management, leadership and innovation strategies.


14:15
The promise of digital olfaction
Tristan Rousselle, Aryballe Technologies
×

Emerging Opportunities and Applications

Presentation

The promise of digital olfaction

It is now possible to get numerical data out of tastes and smells. New technologies are currently being developed which will allow the manufacturing of small portable and universal artificial noses. This will enable the acquisition of numerical information about smells and tastes. These Sensors will initially be launched in the industry for olfactory quality control. But this technology will unveil all it’s potential when it will be accessible to all publics. They will the be embedded in kitchen appliances, smart home devices robots but also “smart” cars.

Speaker

Tristan Rousselle

Aryballe Technologies


Tristan Rousselle holds a Ph.D. in cell biology from the University Joseph Fourier in Grenoble. He did part of his post graduated studies in Sussex University (Brighton-UK) and La Jolla Institute for Allergy and Immunology (San Diebo-CA) He co-founded in 2000 the company Protein’eXpert now called PX'Therapeutics. This biotechnology company is specialized in the engineering, pre-clinical and clinical development of therapeutic proteins. In 2011 PX'Therapeutics had more than 60 employees in Grenoble and Lyon and was realizing nearly 50% of its Turn Over outside Europe.

In July 2013, a few months after the Acquisition of PX Therapeutics by the “Laboratoire Aguettant” Tristan decided to launch a new venture with a lead innovative project in the field of Biosensors named “Aryballe”. He co-founded the company with Delphine Pau, Thierry Livache, Sam Guilaumé and Sissel Tolaas in March 2014. Since then Tristan holds the position of CEO at Aryballe Technologies SA which main objective is to develop the first universal and portable artificial Nose. In July 2016 & 2017 the company raised 3 M € with international investors and industrial partners. The first product, NeOse Pro has been launched in January 2018.


14:35
Heterogeneous Integration and its impact on High Volume Manufacturing
Maurus Tschirky, Evatec
×

Emerging Opportunities and Applications

Presentation

Heterogeneous Integration and its impact on High Volume Manufacturing

Digging underneath the surface of the shiny IoT reveals a fascinating new reality of technology combinations beyond classic metallization. The ubiquitous use and combination of advanced functional materials and layer stacks are the enabling technology for the sensors at the core of every node connected to the IoT and ask for special attention in manufacturing. Material pairings, behavior and specific treatment require new concepts and features of the equipment itself. With the examples of Optical Interference Coatings and Piezoelectric Layers this presentation explains what More-than-Moore means from the perspective of an equipment supplier.

Speaker

Maurus Tschirky

Evatec


Maurus Tschirky is Senior Manager Product Marketing, responsible globally for the market segments MEMS and Photonics in terms of strategy and strategic project and customer acquisition. Within the MEMS market segment, he has a particular interest in advanced functional materials such as piezoelectric and magnetic materials. He has held a number of positions in the PVD-equipment industry (Balzers, Unaxis, Oerlikon and most recently Evatec) within application and system engineering, project and product management. As Business Development Manager at ACUTRONIC he facilitated their Inertial Testing Service for MEMS and prior to joining Evatec in 2016, he spent 3 years leading a research section at CSEM in Neuchatel, Switzerland. He holds a first degree as Engineer in Control Electronics from the University of Applied Sciences in Buchs, and a Masters in Business Engineering / International Marketing from the Hochschule für Wirtschaft und Technik in Zurich, Switzerland awarded in 2009.

14:55
Presentation to be announced
Peter O'Brien, Tyndall National Institute
×

New Approaches for Power Control and Energy Harvesting

Presentation

Presentation to be announced

This presentation's abstract will be available shortly.

Speaker

Peter O'Brien

Tyndall National Institute


Dr. Peter O’Brien obtained his PhD in Physics from University College Cork in 1999. He has a Masters in Electronic Engineering and Degree in Physics from Trinity College Dublin. He was a postdoctoral scholar at the California Institute of Technology and research scientist at NASA’s Jet Propulsion Laboratory in Pasadena (Micro Devices Laboratory) where he worked on the development of millimetre wave devices for remote sensing applications. Dr O’Brien co-founded one (Biosensia) and founded a second company (Epi-Light). His second company, Epi-Light limited, developed speciality photonic systems for medical device and pharmaceutical applications. He successfully sold the company in 2009 and returned to the Tyndall National Institute to establish a research activity in advanced photonic packaging. Dr O’Brien is now head of the Photonics Packaging Group and is involved in a wide range of both academic and industry research projects, across the telecoms and medical device sectors. Dr. O’Brien is also deputy director of the Science Foundation Ireland, Irish Photonic Integration Centre


15:15
Panel Session Emerging Opportunities & Applications
Rainer Minixhofer, Pierre-Damien Berger,
×

Panel Session

Emerging Opportunities & Applications

This panel session's abstract will be available shortly.

Speakers

Rainer Minixhofer

AMS AG

Pierre-Damien Berger

CEA-Leti

15:45
Afternoon Refreshment Break
16:15
Silicon radars and smart algorithms: a unique combination for disruptive innovation in perceptive IoT systems
Nora Maene, imec
×

Radar and LiDAR Innovations

Presentation

Silicon radars and smart algorithms: a unique combination for disruptive innovation in perceptive IoT systems

Perceptive IoT systems are cyber-physical systems with perception and connectivity capabilities on par or superior to those of humans. Thanks to these capabilities, they can seamlessly blend into our everyday environments, creating a fully intuitive IoT. The autonomous car is a very well-known example that combines cutting edge sensing and processing capabilities with the latest wireless connectivity to this effect. When technology cost comes down and manufacturing volumes go up, plenty more applications will emerge, leading to truly smart cities, infrastructure, homes and industrial environments.

Radar is such a sensing technique currently undergoing dramatic reduction of cost, power consumption and form factor combined with an increase in resolution and algorithmic capabilities. These advances are driven by semiconductor technology scaling and machine learning improvements. In this talk, we will address both those aspects and review recent developments in 79GHz and 140 GHz CMOS radar as well as in advanced machine learning capabilities.


Speaker

Nora Maene

imec


Nora is business development manager for IoT at imec, Belgium, covering mm-wave communications, mm-wave radar and ADC’s. Her background is in telecommunications marketing and she started her career on nano-electronics technology and reliability assessment. She has a master’s degree in electrical engineering from the Catholic University Leuven (KUL), Belgium, and a marketing telecommunications postgraduate from the INSEAD Business School in Fontainebleau, France.


16:35
Photonic integrated circuits for LiDAR
Iñigo Artundo, VLC Photonics
×

Radar and LiDAR Innovations

Presentation

Photonic integrated circuits for LiDAR

Modern imaging systems measure distance and direction from an emitter to the surroundings, allowing for full 3D mapping, even in real time. LIDAR technology uses optical signals in the visible and near infra-red spectrum, achieving better resolution and depth precision, and have been applied to many fields, from intelligent vehicles and drones, to robotics, medical instrumentation, consumer electronics and sensing. However, most beam steering systems for LIDAR are still bulky, not robust and expensive, and therefore not suitable for mass introduction in certain markets. Photonic integrated circuit (PIC) technology has emerged to provide low-cost, compact, robust and energy-efficient optical systems, integrating components like lasers, detectors, modulators, or filters on a single semiconductor chip. Over the last years, there has been significant efforts and investment to integrate beam steering systems on PICs, with several optical phased arrays demonstrated. In this presentation, we will evaluate PIC advantages for LIDAR and review the state of the art of integrated optical phase arrays.

Speaker

Iñigo Artundo

VLC Photonics


Iñigo Artundo holds M.Sc. in Telecom Engineering at UPNa (Spain, 2005), and Ph.D. in Applied Physics and Photonics at the VUB (Belgium, 2009). He participated in several European research projects on micro and nano-optics, and reviewed for scientific journals and funding agencies. He holds a MBA and membership of IEEE, SPIE and COIT.

17:00
Closing Remarks by Mark Andrews, Conference Chair
17:25
Networking Drinks Reception and Buffet
Day 2 - Wednesday 11th April 2018
08:00
REGISTRATION - Includes Refreshments
09:00
Housekeeping by Mark Andrews, Conference Chair
09:10
High-End Sensors & Sensor Systems: How to achieve high metrological performances
Sergey Yurish, International Frequency Sensor Association
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Metrology and Test for High-End Sensors

Presentation

High-End Sensors & Sensor Systems: How to achieve high metrological performances

The presentation will describe modern developments and trends in the field of high-end sensors and sensor systems design. Its background is based on programmable parameter-to-frequency (time) converters as a digital sensor’s core and structural-algorithmic methods for data extraction in order to move from a traditional analog-to-digital conversion to alternative frequency (period, duty-cycle, time interval)-to-digital conversion. Working in the frequency-time signal domain simplifies design, and obviates some technical and technological problems, due to the properties of frequency as an informative parameter of sensors and transducers. The major benefits offered by such an approach are high reliability, high metrological performance, wide functionality, cost effectiveness and scalability. Different examples of high-end sensors and sensor systems will be given and discussed in details.

Speaker

Sergey Yurish

International Frequency Sensor Association


Dr. Sergey Yurish is President and co‐founder of the International Frequency Sensor Association (IFSA), Sensors Web Portal, Inc. (Canada) and Excelera, S.L. (Spain).

He is an Editor‐in‐Chief of Sensors & Transducers journal, Magazine (e‐Digest) and IFSA Newsletter. Dr. Yurish has over 30 years of research and academic experiences during which he has developed numerous research and development projects on an international level in frames of various programmers, including NATO, FP6 and FP7. Sergey Yurish was a Marie Curie Chairs Excellence investigator in Technical University of Catalonia (UPC, Barcelona, Spain) in 2006‐2009, where he led and developed one of the most successful projects in the UPC on Smart Sensors Systems Design (SMARTSES), totaling 425,000 EUR. His research interests include self‐adaptive intelligent and smart sensors systems, novel methods for frequency measurements and adaptive frequency‐to‐digital conversion. Sergey Yurish is an author of several publications, which have received the Best Articles and Papers Awards. Dr. Yurish is an IARIA Fellow and Advisory Chairman of SENSORDEVICES, SENSORCOMM, CENICS, ALLSENSORS and SIGNALS IARIA conferences. He is a founder and chairman of annual conferences SEIA, OPAL and MicDAT. He holds 9 patents and has published more than 170 publications including research papers and articles in peer reviewed international journals, workshops, conferences and symposiums, and ten books published by John Wiley & Sons, Springer, Kluwer and IFSA Publishing.

09:30
Quantum Well Hall Effect (QWHE) sensors for Non- Destructive Imaging applications.
Mohamed Missous, University of Manchester
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Metrology and Test for High-End Sensors

Presentation

Quantum Well Hall Effect (QWHE) sensors for Non- Destructive Imaging applications.

A new class of highly sensitive Quantum Well Hall Effect (QWHE) sensors have been developed and commercialised. These magnetic sensors include single, linear and 2D arrays magnetovision systems. DC and AC magnetic fields can be measured with magnetic and spatial resolutions of < 50nT and 0.5mm respectively. Using specially integrated AC illumination coils, these magnetic cameras can be used to detected defects and flaws in magnetic and nonmagnetic materials. Using advanced DSP and high-resolution ADCs, the systems can increase AC and DC magnetic field scanning frame rate and reconstruct images by measuring AC magnetic field at different frequencies.

Speaker

Mohamed Missous

University of Manchester


Mohamed Missous, FREng, is Professor of Semiconductor Materials and Devices at the University of Manchester and founder and CTO of Advanced Hall Sensors (AHS) ltd. His areas of expertise include Molecular Beam Epitaxy of Quantum Well Hall Effect (QWHE) sensors, high speed InP transistors, photoconductive THz materials and sub-millimetre wave Tunnelling Devices. His team has a long history of studying the manufacturability of Quantum Mechanical based devices and technology transfer that have led to successful commercialisation of QWHE and THz sensors and Photonic devices. He is regularly invited to give talks at international venues on QWHE sensors, mmwave/THz technologies. 

09:50
Physical, chemical and biological sensors: meeting requirement in various industries
Diego Reyes, Innovative Sensor Technology
×

Metrology and Test for High-End Sensors

Presentation

Physical, chemical and biological sensors: meeting requirement in various industries

Sensors from physical to chemical and biological and their role in demanding applications are described. Challenges in the development, production and quality control vary significantly according to sensor type and application. Some examples on what to consider when dealing with different industries and their requirements are discussed. Furthermore, a special view on innovations and a reflection on the importance of developing more sensor technologies will be given to enable sensor industry growth also in the future.

Speaker

Diego Reyes

Innovative Sensor Technology


Diego received his BSc (2005) and MSc (2007) degrees in Electrical and Electronics Engineering at Universidad de los Andes (Colombia). In 2007 he joined the Department of Electrical and Electronics Engineering as a full time Instructor. In 2008 he joined CMS collaboration within the European Organization for Nuclear Research (CERN) as Data Operator in charge of software validation. From 2010 to 2014 he completed his PhD degree on Microsystems Engineering at the University of Freiburg (Germany). Since 2014 he joined Innovative Sensor Technology IST AG for the development of chemical sensors (conductivity) and biosensors.

10:10
High Performance Fiber Sensing using Integrated Photonics
Pim Kat, Technobis
×

Metrology and Test for High-End Sensors

Presentation

High Performance Fiber Sensing using Integrated Photonics

Integrated photonics is emerging as an enabling and exciting technology platform for fiber sensing solutions. The ability to replace traditional assemblies of multiple discrete optical or micro-optical components by a single small sized chip, make Photonic Integrated Circuits (PICs) increasingly favorable for next generation fiber sensing systems. Technobis commercially delivers unprecedented performances and manufacturing competences in fiber sensing. The versatility of capabilities, miniature footprint and low cost has a huge market potential, not only for new next generation systems but also complimentary to existing metrology systems.

Speaker

Pim Kat

Technobis


Pim Kat has a background in mechanical engineering. He worked as researcher at Hoogovens in the field of computer controlled motion (what is now mechatronics). He started his own company Technobis in 1996.
Technobis Group in 2014 consists of three companies Technobis Mechatronics (development and supply of OEM instruments), Technobis Fibre Technologies (sensing systems based on Integrated Optics) and Technobis IPPS (packaging services for integrated optical chips).
Besides being the CEO of the Group, Pim is involved in most of the R&D work for integrated photonics.


10:30
Morning Refreshment Break
11:10
VCSEL Pilot Line for ranging and 3D gesture control sensors
Iwan Davies, VIDaP Consortium
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Emerging Opportunities and Applications

Presentation

VCSEL Pilot Line for ranging and 3D gesture control sensors

VCSELs are key components enabling many fast growing markets, including optical sensors. As GaAs-based semiconductor components, they can be processed cost-efficiently, resembling LED processing: IQE is the manufacturer of epitaxial material, while Philips has a production line for front-end and back-end processing. One pilot-line end customer, STm, designs VCSELs into Time-of-Flight sensor products, capable of making accurate distance measurements, based on the round-trip travel time of photons between the VCSEL and a CMOS sensor. Uses for ToF using VCSELs ranges from advanced proximity sensors to 3D gesture detection modules, benefiting e.g. smartphone/tablets, laptops/monitors, consumer robotics, gaming, security & building management and automotive.

Speaker

Iwan Davies

VIDaP Consortium


Dr. Iwan Davies obtained a B.Sc (Hons) in Chemistry from Imperial College, London and a Ph.D. on MOVPE Studies in Compound Semiconductors from the University of Manchester. He is a member of the Royal Society of Chemistry. With over 35 years-experience in III-V and II-VI semiconductor epitaxial growth by MOVPE, he has co-authored over 100 publications covering a very broad range of optoelectronic devices and material systems. Following a period of research and development at Plessey Research (Caswell) Ltd., he has managed the growth and characterization of epi-wafers, plant operations and product engineering, principally for GaAs and InP-based material systems at IQE. He is currently IQE plc Group Technology Director, with responsibilities for UK & European Research Project Co-ordination.

11:30
Fiber optic ultra high temperature (1000°C) vibration sensors
Nicholas Burgwin, Fibos
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Imaging and Optical Sensing Advances

Presentation

Fiber optic ultra high temperature (1000°C) vibration sensors

Accelerometers used to monitor component vibration are increasingly being placed in harsh environmental conditions. Vibration monitoring, such as turbine blade or exhaust vibration, require measurements to be made in elevated temperature environments that well exceed the acceptable operating conditions of traditional piezoelectric accelerometers. Fibos has developed the worlds first ultra high temperature accelerometer that can operate up to 1000°C (~1800°F) utilizing a fiber optic sensor. This presentation will dive into the details of how the accelerometer is made, evaluate the performance characteristics of it, and highlight other benefits of the optical sensing element such as EMI immunity.

Speaker

Nicholas Burgwin

Fibos


Nicholas graduated from the University of Toronto in 2010 as an Electrical Engineer and went straight into industry. Throughout his time in industry, he worked on a number of sensor applications and quickly began to recognize the limitations that exist with electrical solutions. With a background in solving real world problems, Nicholas went back to university and completed his Master’s degree at Ryerson University in August 2016, with his research focused towards developing a unique, low-cost fiber optic sensing solution that could enable the replacement of conventional electrical strain gauges. Fibos was founded to realize successful commercialization of this technology.

11:50
Wafer processing techniques for sensing applications in consumer electronics
Martin Eibelhuber, EV Group
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Advances in MEMS Sensor Development

Presentation

Wafer processing techniques for sensing applications in consumer electronics

Sensors in consumer electronics are mainly dominated by the MEMS industry as they can provide solutions for a multitude of applications with the high performance and smallest form factors. Wafer bonding is an enabling technology for MEMS sensors as it allows not only the encapsulation of thousands of devices in a single step but is also key to the device performance itself. For example, wafer bonding allows hermetic sealing, encapsulation of defined gas mixtures, defined pressure or vacuum while providing the highest reliability.

In addition to incorporating an ever-increasing number of MEMS sensors, today’s consumer electronic products also require novel solutions for environmental, health and optical sensing. Optical sensing in particular has recently gained a lot of momentum for 3D sensing, biometric authentification and spectral imaging. As a result, wafer processing techniques for optical components and stacks, such as lens molding and nanoimprint lithography, have become key to achieving widespread implementation of these novel optical sensing solutions.


Speaker

Martin Eibelhuber

EV Group


Martin Eibelhuber is business development manager at EV Group for bonding, lithography and nanofabrication technologies and particularly focusing on compound semiconductors.He holds a PhD (Dr. techn.) in technical physics from the Johannes Kepler University Linz specialized on nanoscience and semiconductor physics. As a university staff member he gained professional experience in photonics, nanofabrication and material characterization. 

12:10
Al2O3 Interdigitated Capacitors (AOIC) - Past, Present and Possible Future in Biosensing Applications.
Luis Moreno Hagelsieb, imec
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Imaging and Optical Sensing Advances

Presentation

Al<sub>2</sub>O<sub>3</sub> Interdigitated Capacitors (AOIC) - Past, Present and Possible Future in Biosensing Applications.

Simple, low cost and low consumption devices are required in medical, agronomical and environmental monitoring applications. A faster response, high response, highly sensitive, highly selective sensor devices for application in bacteria detection have become very critical. Current detection system takes minimum 2 hours (expensive devices) to one week, while fast detectors work only when target concentrations is high. In previous works at “Université catholique de Louvain”, high-performance Al2O3 interdigitated capacitors sensors with; very low power consumption and broad applications, were developed and successfully tested on DNA hybridization, bacteria, spores and breathing monitoring. The market trends were analyzed. This presentation covers the complete story about this biosensor, development, applications, comparative tests as well as possible future developments.

Speaker

Luis Moreno Hagelsieb

imec


Dr. Luis Moreno Hagelsieb, born in Mexico, Chemical Engineer (Universidad Autónoma de Guadalajara 1989), MSc in Electrical Engineering (CINVESTAV México 1999). From 1992 to 2001 worked as semiconductor process/product improvement and design at Motorola Inc. He finished his PhD and worked as researcher at the Université Catholique de Louvain in Belgium until 2012, emphasizing his work on biosensors design and commercialization. He has also experience in MEMS and sensor devices (UCL, Samsung) and radiation and optical sensing (Canberra, vivaMOS). He’s been referee for journals like “Biosensors and Bioelectronics”. Currently working at the ‘Thin Film Photo Diodes” area at IMEC in Belgium.

12:30
Lunch Break
13:45
Advanced Sensor Design Enablement
Ian Dennison, Cadence Design Systems
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Enhancing Sensor Performance: Embedded, SoC and Machine Learning

Presentation

Advanced Sensor Design Enablement

Advanced Sensors demand an advanced toolkit. Cadence Design Systems provides unique design enablement for advanced design fabrics, and their integration for complex sensors. Automotive, for instance, is driving a boom in lidar and radar design, and driving design into silicon photonics, MEMS, uW/RF, advanced node SoC, and advanced SiP. Lidar/radar needs mixed-signal design for control, and low-power. Advanced sensors are often also smart, and connected, demanding SoC IP for dsp, baseband and AI, and with software often the determinant of time-to-market high-performance emulation of sensor SoCs for software development provides accelerated entry into markets. We will examine Cadence’s advanced sensor toolkit through applications in Automotive, Robotics and IoT.

Speaker

Ian Dennison

Cadence Design Systems


Ian Dennison is a Cadence Design Systems Senior Group Director, Custom IC and PCB Group. Ian’s experience spans 35 years within the Electronic Design Automation industry, with expertise in design enablement for analog, digital, mixed-signal, silicon photonics, MEMS, substrate, and system design. Managing the Cadence R&D office in Scotland, Ian's has focus on future flows, design fabrics, and emerging markets.

14:10
Secure & intelligent sensing for smart building and city solutions
Marianne Vandecasteele, imec
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Enhancing Sensor Performance: Embedded, SoC and Machine Learning

Presentation

Secure & intelligent sensing for smart building and city solutions

A safe and efficient infrastructure is the foundation on which an economy is built and is allowing us to adapt to the pressures of rapid urbanization, climate change, and other trends; To come to such an infrastructure it is a must to combine advances in sensors, controls, and software. The talk will focus on required advances in sensors for smart building solutions and how these will make informed operating practices possible and in this way maximize benefits to human health and well-being while minimizing energy consumption. Monitoring the air quality and making the data that’s relevant available, is the first step towards awareness and developing such a system wide solution. To achieve this goal, measuring sufficient spatial and temporal data is critical and hence dense sensor networks are needed. The talk will outline the state-of-the-art in gas sensors for air quality monitoring networks and considers emerging and potential future developments.

Speaker

Marianne Vandecasteele

imec


Marianne Vandecasteele studied Electrical Engineering at the Catholic University Leuven in Belgium, where she graduated in 1990. In 1990, she joined Philips Research in Eindhoven, the Netherlands as Analog Circuit Design Engineer in the area of low-power analog and mixed-signal circuit design in CMOS technology. From 2000, she worked at NXP Semiconductors as System Engineer, system Architect and team lead in different system domains. In 2010, she joined Holst-Centre/Imec, the Netherlands where she has been responsible as technical lead for different types of sensor systems, both in IMECs wireless health program and more recent IMECs Intuitive Internet of Things program.

14:35
Challenges for Optical and IR Sensors for Future Defence Aircraft
Henry White, BAE Systems
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Defence, Security, Aviation and Aerospace High-End Sensors

Presentation

Challenges for Optical and IR Sensors for Future Defence Aircraft

Military air platforms are a challenging environment for sensing systems. The system requirements are increasing as sophisticated pilot assisted systems as well as complete autonomous operation mature. Increased emphasis on stealthy aircraft restricts the use of active systems and place significant demand on the physical realisation. Threats that need to be detected are becoming more challenging in terms of their signature and the distances over which they need to be detected. The presentation will discuss these challenges in relation to optical and IR sensors and how technology developments are required to address them.

Speaker

Henry White

BAE Systems


Henry White joined the Sowerby Research Centre of British Aerospace in 1983 which became the Advanced Technology Centre of BAE Systems in 2000. In 2015 he took up the position of Lead Technologist Sensing within the Military Air & Information part of BAE Systems. Technical expertise covers: long range sensing requirements and technologies, fibre optic digital communications, EO sensor technologies, novel imaging systems, high power laser systems, optical wireless communications and underwater optical systems. Since 2008 BAE Systems has been the UK Sport's Official Research and Innovation Partner and in 2015 Henry also became the Lead Engineer for the Partnership.

15:00
The rise of the high-end inertial sensing market is discretely nourished by the "robotic vehicles" trend
Guillaume Girardin, Yole Développement
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Defence, Security, Aviation and Aerospace High-End Sensors

Presentation

The rise of the high-end inertial sensing market is discretely nourished by the "robotic vehicles" trend

Fueled by geopolitical risks rising defense investments, commercial aerospace and fast-growing applications, this new prosperous cycle of the high end inertial business will bring the market to new heights. Indeed, despite attracting growth in usual businesses, the growth of the high end inertial market is expected to come substantially from the industrial market and particularly the robotic vehicles.

The advent of the robotic era in the automotive space will boost the market and show very attractive volume and revenues. In our presentation, we will give an overview of the different markets from defense, aerospace, naval to industrial ones, who are the big players and what can be expected in a near future.


Speaker

Guillaume Girardin

Yole Développement


Dr. Guillaume Girardin works as a Market & Technology Analyst for MEMS devices and technologies at Yole Développement, the "More than Moore" market research and strategy consulting company. Guillaume holds a Ph.D. In Physics and Nanotechnology from Claude Bernard University Lyon 1 and a M.Sc. in Technology and Innovation Management from EM Lyon School of Business.

15:25
Interactive Q&A
15:50
Closing Remarks by Mark Andrews, Conference Chair

Book your place today for 2019 - 3 events, 2 days, 1 ticket
The must attend conference for all professionals involved within the sensor solutions market.